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aolofsson/awesome-semiconductor-startups: Open database of awesome semiconductor startups

aolofsson/awesome-semiconductor-startups: Open database of awesome semiconductor startups

22 hours ago

An Open Database of Awesome Semiconductor Startups

Dashboard: wafer map, technology, country, founding-year and exit charts, and the investor ecosystem map</a>

Search, filter and chart the whole database, including exits, in the interactive dashboard. It reads the CSV files in this repository, so it always matches the tables below.

Citation:

If you use this repository in research, articles, presentations, or market analyses, please cite:

Andreas Olofsson. Database of Awesome Awesome Semiconductor Startups.
GitHub repository.
https://github.com/aolofsson/awesome-semiconductor-startups

BibTeX:

@misc{olofsson_awesome_semiconductor_startups,
  author = {Andreas Olofsson},
  title = {Database of Awesome Semiconductor Startups},
  year = {2026},
  howpublished = {\url{https://github.com/aolofsson/awesome-semiconductor-startups}}
}

Adding a company:

  1. Create a branch
  2. Add entry to './startups.csv'
  3. Run '$ python ./update.py'
  4. Run '$ python ./check.py' and fix any errors it reports
  5. Submit a Pull Request

Submission Guidelines:

  • Startup requirements
* startup (ie not steady state) * semi company (ie not application software) * product company (ie. not services)
  • Alphabetical listing
  • Short single sentence description
  • No Performance claims in description!
  • All entries must be confirmed with public link
  • Max 80 char display width
  • Categorize the startup based on technology table below
  • Use standard two letter country codes
  • Do NOT edit the README directly, it's auto-generated

Disclaimer:

This databse is volunteer work. We do not guarantee correctness. All information was gathered via public web sites and/or first hand knowledge.

DATA IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE AUTHORS OR COPYRIGHT HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM, OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR OTHER DEALINGS IN THE SOFTWARE.

Categories

| Technology| Description | |-----------|--------------------------------------------------| |ASIC | Custom silicon | |AI | AI hardware | |ANALOG | All things analog | |CHIPLETS | Chiplet related | |EDA | Design automation tools | |FPGA | Field-programmable gate array | |HEALTH | Health centric devices | |HPC | High performance computing | |MEMORY | Memory | |MEMS | MEMS based technology | |MFG | Manufacturing related | |NETWORKING | Various connectivity pieces | |RF | Wireless | |PHOTONICS | Photonic based startups | |QUANTUM | Quantum computing | |RISC-V | RISC-V based startups | |SECURITY | Security technology | |SENSORS | Sensing devices | |SPACE | Space technology |

Startups

| Company | Technology | Founded | Country | Description | |---------|------------|---------|---------|-------------| |2D Photonics | PHOTONICS | 2018 | IT |Graphene-based optical transceivers | |3D Glass Solutions | MFG | 2005 | US |Glass substrates and interposers for advanced packaging | |Abacus Semiconductor | HPC | 2020 | US |HPC silicon systems | |AccelerComm | RF | 2016 | GB |5G physical layer for high-performance networks | |Active Layer Parametrics | MFG | 2014 | US |Electrical depth-profiling metrology for semiconductor layers | |Aerogen Systems | MFG | 2026 | US |Tool-integrated contamination control for chip fabs | |Agentrys | EDA | 2025 | US |Self-Improving Agentic Design Automation Toward Autonomous Design | |Agile Analog | EDA | 2017 | GB |Automating design of analog circuitry | |Agita Labs | SECURITY | 2018 | US |Processing security technology/IP | |Agnit Semiconductor | MFG | 2019 | IN |GaN based wafers and devices | |Ahead Computing | RISC-V | 2024 | US |High performance RISC-V core IP | |AiNEKKO | RISC-V | 2023 | US |Open RISC-V manycore silicon for edge AI inference | |Aistorm | AI | 2011 | US |Charge domain based AI processing | |Akhetonics | PHOTONICS | 2021 | DE |Optical computing devices | |AlixLabs | MFG | 2019 | SE |Atomic layer etching tool for pitch splitting | |Allspice.io | EDA | 2018 | US |PCB Design platform | |Ambient Scientific | ANALOG | 2018 | US |Analog in-memory AI processor | |Amsimcel | EDA | 2018 | RO |GPU powered physical verification | |Anabrid | ANALOG | 2023 | DE |Analog computer on a chip | |Analog Photonics | PHOTONICS | 2012 | US |LIDAR and other optical technologies | |Andapt | ANALOG | 2014 | IE |Programmable power management ICs | |Anello | PHOTONICS | 2018 | US |Photonic based gyroscopes for navigation | |Aniah | EDA | 2019 | FR |Circuit analysis software | |Applied Brain Research | AI | 2013 | CA |AI solutions for edge devices | |Arago | PHOTONICS | 2024 | FR |Photonic computing platform | |Archgen Labs | EDA | 2026 | US |AI agent for physical design of 3D-stacked chips | |Architect Labs | EDA | 2025 | US |AI system that designs and verifies custom chips | |Argus Space | RF | 2024 | CH |Satcomm telecommunications and radar | |Arycs Technologies | PHOTONICS | 2026 | US |Coherent DSP and silicon photonics optical engines | |Ascenium | HPC | 2019 | NO |General purpose accelerator | |Aspinity | AI | 2015 | US |Analog in-memory AI inference accelerators | |Astrus | EDA | 2022 | CA |AI platform designed to automate microchip design | |Atlant 3D | MFG | 2018 | DK |Atomic scale 3d material printing | |Atlas Magnetics | ANALOG | 2021 | US |Power management ICs and configurable ASICs | |Atmosic | RF | 2016 | US |Battery free wireless devices | |Atom Computing | QUANTUM | 2018 | US |Quantum computers based on optically trapped neutral atoms | |Atoms AI | EDA | 2024 | US |AI driven verification | |atopile | EDA | 2023 | US |Language and tools to design PCBs as code | |Atrisa | EDA | 2026 | US |AI agents for analog circuit design | |Attotude | NETWORKING | 2024 | US |Waveguide interconnects for AI data centers | |Aule Technologies | EDA | 2022 | US |AI/physics based design platform | |Avicena | PHOTONICS | 2019 | US |Optical uLed interconnect technology | |Avronna | EDA | 2022 | US |AI for chip design and verification | |Axelera | AI | 2021 | NL |Low power AI edge processors | |Axonne | NETWORKING | 2018 | US |Automotive Ethernet PHYs | |Ayar Labs | PHOTONICS | 2015 | US |Electronic-photonic communication chip sets | |Ayo Semiconductor | PHOTONICS | 2024 | US |Photonic AI acceleration using novel photonic processes | |Azimuth AI | ASIC | 2023 | US |Edge AI ASICs | |Baud | AI | 2026 | US |Multiplier-free ASIC for AI training and inference | |Baya Systems | CHIPLETS | 2023 | US |Chiplet Based Semiconductor Design | |Beacon Photonics | PHOTONICS | 2023 | US |Integrated photonics platform | |Beam | RF | 2015 | IL |Phased array antennas | |Belfort | SECURITY | 2025 | BE |Hardware for encrypted compute (FHE) | |Black Semiconductor | MFG | 2021 | DE |Graphene electronics/photonics translators | |Blueshift Memory | MEMORY | 2016 | GB |High performance memory centric architecture | |Bluespec | RISC-V | 2003 | US |RISC-V IP and System Development Tools | |Blumind | AI | 2020 | CA |Analog AI computing | |Bolt Semiconductor | MFG | 2024 | US |Vertical GaN technology | |BoolSi | EDA | 2023 | US |Generate RTL from any code base, in any language | |bos semiconductors | ASIC | 2022 | KR |Automotive ASICs | |Brilliance RGB | PHOTONICS | 2022 | NL |Integrated RGB laser chips for AR displays | |Bronco AI | EDA | 2022 | US |AI tools for chip development | |Build4Sim Inc | EDA | 2025 | US |Accelerating Spice simulation | |cadlab.io | EDA | 2015 | US |Collaboration tools for PCB design | |Cadstrom | EDA | 2023 | CA |AI based PCB design | |Cambridge GaN Devices | ANALOG | 2016 | GB |Fabless GaN power transistors and ICs | |Cambridge Terahertz | SENSORS | 2023 | US |Terahertz imaging sensors for threat detection | |cassia.ai | AI | 2021 | US |AI Hardware IP | |Celera Semiconductor | EDA | 2018 | US |Automated analog/mixed-signal IC development tool | |Celero Communications | NETWORKING | 2024 | US |Coherent DSP platform for high-bandwidth low-power optical connectivity | |Cellium | RF | 2016 | IL |Wireless infrastructure for indoor connectivity | |Celtro | HEALTH | 2019 | DE |Energy harvesting implantable medical devices | |Celus | EDA | 2016 | DE |PCB design tools | |Ceremorphic | HPC | 2020 | US |Analog computing architecture | |Cerfe Labs | MFG | 2020 | US |Electronics materials and device research | |ChipAgents | EDA | 2024 | US |Agentic AI chip design environment | |ChipCraft | ASIC | 2016 | PL |GNSS receiver and RISC-V based SoC | |Chipflow | ASIC | 2021 | GB |ASIC design platform | |Chipletz | CHIPLETS | 2021 | US |Smart substrate for chiplet integration | |Chipmind | EDA | 2024 | CH |Agentic chip design | |ChipNexus | EDA | 2023 | US |AI agents for chip design automation | |Circuit Mind | EDA | 2018 | GB |PCB design tools | |CircuitLeap.ai | EDA | 2024 | PT |Automated analog design with GPU and AI | |Codasip | RISC-V | 2014 | DE |Supplier of RISC-V IP cores | |Cognichip | EDA | 2024 | US |AI platform for chip design | |CopperPilot | EDA | 2025 | US |AI agent for circuit board design | |Cornami | HPC | 2011 | US |Acceleration for full homomorphic encryption | |Cortisonic | AI | 2025 | AU |Edge AI chips built from nanomechanical oscillators | |Cyrillic | AI | 2024 | IT |Perception system for physical AI | |d-Matrix | AI | 2019 | US |Computing platform for data center AI inference | |DASH Tech IC | HPC | 2021 | US |Flexible processors for embedded applications | |DeepSim | EDA | 2020 | US |AI-based thermal simulator for chip design | |DeepX | AI | 2018 | KR |AI processors | |DeGirum | AI | 2017 | US |AI platform for edge applications | |Denpaflux | EDA | 2022 | DE |EMC analysis platform for design engineering teams | |DensityAI | AI | 2025 | US |Full-stack AI inference chips and systems | |Deteqt | SENSORS | 2023 | AU |Diamond-on-silicon quantum magnetometer chips | |Diamond Quanta | MFG | 2024 | US |Engineered diamond materials and devices | |Diode Computers | EDA | 2024 | US |AI based PCB design | |Diraq | QUANTUM | 2021 | AU |Silicon spin-qubit quantum computers | |Discovered Materials | MFG | 2026 | US |AI agents that discover materials for semiconductors | |Dnotitia | AI | 2023 | KR |AI processors | |Dover | SECURITY | 2017 | US |SoC security IP | |EdgeCortix | AI | 2019 | US |AI accelerators for edge devices | |EdgeQ | RF | 2018 | US |Base station-on-a-chip | |EFFECT Photonics | PHOTONICS | 2010 | NL |Monolithic indium phosphide tunable laser assemblies | |Efficient Computer | HPC | 2022 | US |Energy efficient general-purpose processor | |Efinix | FPGA | 2012 | US |Programmable FPGA products | |Eliyan | CHIPLETS | 2021 | US |Interconnect technology | |EnCharge AI | AI | 2021 | US |AI processing platform | |Enlightra | PHOTONICS | 2017 | CH |Optical microresonator technology | |enzzo | EDA | 2024 | US |AI driven hardware development | |EPIC Microsystems | ANALOG | 2024 | US |Hybrid switched-capacitor power delivery for AI servers | |Equal1 | QUANTUM | 2017 | IE |Silicon spin qubits for scalable quantum computing | |Eridan | RF | 2013 | US |RF front end for wireless telecommunications | |Eridu AI | PHOTONICS | 2023 | US |Photonics based AI acceleration | |Etched | AI | 2022 | US |AI processors | |Ethernovia | NETWORKING | 2018 | US |In vehicle networking | |eTopus | NETWORKING | 2013 | US |High speed interconnect solutions | |Euclyd | AI | 2024 | NL |AI inference silicon and systems | |Everactive | SENSORS | 2012 | US |Battery-less IoT sensing technology | |Exo Imaging | HEALTH | 2015 | US |Handheld ultrasound device | |Extropic | AI | 2022 | US |Physics based generative AI | |Fabric Cryptography | SECURITY | 2021 | US |Cryptography hardware accelerators | |Falcomm | RF | 2021 | US |Solid state power amplifiers | |femtoAI | AI | 2018 | US |Sparse AI accelerator chips and model compression | |Fermionic | ANALOG | 2020 | IN |Communication IP and chips | |Finchetto | PHOTONICS | 2020 | GB |Photonic sensors for quantum computing | |Finwave Semiconductor | RF | 2012 | US |GaN-on-Si RF transistors and devices | |Flow Computing | HPC | 2024 | FI |Parallel processing IP | |Flux | EDA | 2019 | US |PCB design tools | |FMC | MFG | 2015 | DE |Ferroelectric non-volatile RAM | |Forefrontrf | RF | 2020 | GB |Wireless communication devices | |Fractal Semiconductor | MFG | 2026 | US |AI models for chip manufacturing process development | |Fractile | AI | 2022 | GB |AI accelerator for LLMs | |Furiosa | AI | 2017 | KR |AI coprocessors | |Gemesys | AI | 2021 | DE |Analog AI processors | |Generation Alpha Transistor | EDA | 2024 | US |Circuit & Layout GUI Copilot | |Gigantor Technologies | AI | 2020 | US |Streaming CNN inference hardware for edge vision | |Gowin | FPGA | 2014 | CN |FPGA chip products | |Gyrfalcon | AI | 2017 | US |Low-power AI accelerator chips | |HaiLa | RF | 2017 | CA |Low power wireless communication for IoT | |Hardware Intelligence | EDA | 2026 | US |AI tools for chip simulation waveform capture and debug | |HawAI.tech | AI | 2019 | FR |AI accelerators | |Heronic | EDA | 2024 | GB |Automated generation of bespoke AI accelerators | |HiLight Semiconductor | ANALOG | 2012 | GB |Analog and mixed-signal CMOS ICs for optical communications | |Hiveware | EDA | 2023 | IL |SystemVerilog simulator for SoC verification | |HYFIX | ASIC | 2022 | US |Positioning and control chips for drones and robots | |HyperAccel | AI | 2023 | KR |AI processors and server solutions for LLM/Gen AI | |HyperCIM | AI | 2023 | GB |Optimized compute in memory architecture | |HyperLight | PHOTONICS | 2018 | US |Thin-film lithium niobate photonic integrated circuits | |IC Optimize | EDA | 2025 | DK |Analog circuit sizing and optimization tools | |InCore Semi | RISC-V | 2018 | IN |RISC-V IP cores | |iNGage | MEMS | 2025 | FR |MEMS gyros and inertial navigation sensors | |Ingonyama | SECURITY | 2021 | IL |Hardware accelerators for cryptographic computation | |Innatera | AI | 2018 | NL |Neuromorphic processors | |Inversion Semiconductor | MFG | 2024 | US |Lithography light source using compact accelerators | |Ipronics | PHOTONICS | 2019 | ES |Programmable photonics products | |Jeeva Wireless | RF | 2015 | US |Battery-free wireless sensing technology | |Jitx | EDA | 2016 | US |PCB design tools | |Jmem Tek | SECURITY | 2022 | TW |PUF and post-quantum security IP and chips | |Kandou AI | NETWORKING | 2011 | CH |Chip-to-chip connectivity solutions | |KD | PHOTONICS | 2010 | ES |Optical fiber networking ICs for automotive and industry | |Kepler Computing | HPC | 2018 | US |Stealth | |Keysom | RISC-V | 2022 | FR |RISC-V design platform | |Kneron | AI | 2015 | US |Edge AI devices | |Krutrim | AI | 2023 | IN |AI hardware | |Lace Lithography | MFG | 2023 | NO |Atom-beam lithography systems | |Lamb Labs | AI | 2026 | US |Inference chips with model weights hardcoded | |Lemurian Labs | AI | 2018 | CA |AI computing platform | |Light Solver | PHOTONICS | 2019 | IL |Optical computing platform | |Light Trace Photonics | PHOTONICS | 2021 | GB |Platform for rapid photonic product development | |Lightium | MFG | 2023 | CH |Photonics foundry | |Lightmatter | PHOTONICS | 2017 | US |Optical computing platform | |LightXcelerate | PHOTONICS | 2025 | US |VCSEL-based optical I/O chiplets for AI systems | |Linque | PHOTONICS | 2023 | DE |Optical computing | |Literal Labs | AI | 2023 | GB |Explainable AI using Tsetlin machines | |Lubis EDA | EDA | 2021 | DE |Cloud based formal verification platform | |Ludwig Computing | AI | 2021 | US |Probabilistic computing processors for AI | |Lumai | PHOTONICS | 2021 | GB |3D optical computing | |Luminous Computing | PHOTONICS | 2018 | US |Optical computing platform | |Lumotive | PHOTONICS | 2017 | US |Optical beam forming sensors | |Lux Semiconductors | MFG | 2017 | US |Metal package substrates and interposers for chiplets | |Lyte AI | AI | 2021 | US |Perception layer for physical AI | |Mach42 | EDA | 2019 | GB |AI surrogate models for analog circuit verification | |Magics Technologies | SPACE | 2015 | BE |Radiation-hardened ICs for space systems and nuclear infrastructure | |Maieutic Semiconductors | EDA | 2025 | IN |Generative AI copilot for analog chip design | |Majestic Labs | AI | 2023 | IL |AI processor | |MangoBoost | HPC | 2022 | US |Data processing units for data center | |Matx | AI | 2022 | US |Platform for AGI | |Melten | EDA | 2026 | US |AI design agents that build custom chips from requirement to tested design | |Memryx | AI | 2019 | US |AI computing platform | |Menlo Microsystems | MEMS | 2016 | US |MEMS switches for RF and power | |Mentium Technologies | AI | 2017 | US |AI co-processor chips for space and edge systems | |Mesa Quantum | QUANTUM | 2023 | US |Quantum sensing for GPS | |Metalenz | PHOTONICS | 2016 | US |Metasurface flat optics made in semiconductor foundries | |MicroAlign | PHOTONICS | 2021 | NL |Actively aligned fiber arrays for photonic chips | |Mindgrove | ASIC | 2021 | IN |Fabless SoCs for IoT and edge vision devices | |Mintneuro | HEALTH | 2015 | GB |Neural implants | |mmTron | RF | 2020 | US |Millimeter-wave MMICs for satcom, 5G and defense | |Mobilint | AI | 2019 | KR |AI inference accelerators | |MooresLabAI | EDA | 2025 | US |AI agents for chip design verification | |Morphing Machines | HPC | 2006 | IN |Reconfigurable processors | |Morse Micro | RF | 2016 | AU |Low-power Wi-Fi chips | |Mosaic SoC | ASIC | 2024 | CH |Specialized chips designed for AR glasses | |Motivo | EDA | 2015 | US |Explainable AI and ML for chip design optimization | |Movandi | RF | 2016 | US |RF chipsets | |Movellus | ANALOG | 2014 | US |Clock distribution IP | |mPower Technology | SPACE | 2015 | US |Flexible silicon solar cell modules for spacecraft | |Mueon | CHIPLETS | 2025 | US |Modular 3D compute and memory blocks for AI | |Mythic | AI | 2012 | US |Analog ML accelerators | |MZ Technologies | EDA | 2014 | IT |EDA solutions for advanced packaging | |Nanopower | ANALOG | 2017 | NO |Smart power management ICs | |Nanusens | MEMS | 2014 | GB |MEMS sensors and tunable capacitors built inside CMOS chips | |NcodiN | PHOTONICS | 2023 | FR |Optical interposers | |Nellow | AI | 2024 | FR |Spintronic low-power chips for edge AI | |Neologic | MFG | 2021 | IL |Quasi-CMOS transistor technology | |Netpreme | MEMORY | 2024 | US |AI-Native Memory Systems | |Netrasemi | AI | 2020 | IN |AI Hardware chips | |Neuronova | AI | 2024 | IT |Fully analog neuromorphic processors for always-on sensing | |Neurophos | PHOTONICS | 2020 | US |Optical computing platform | |Neurxcore | AI | 2023 | FR |AI accelerator IP based on NVDLA | |Nexstrom | MFG | 2024 | SG |Wafer-scale 2D TMD semiconductor growth platform | |Next Semiconductor | SPACE | 2023 | US |Satellite networking ASICs | |NextSilicon | HPC | 2017 | IL |High performance computing architecture | |Niobium Microsystems | SECURITY | 2021 | US |FHE Acceleration for Zero Trust | |NLM Photonics | PHOTONICS | 2018 | US |Organic electro-optic materials for silicon photonic modulators | |Normal Computing | AI | 2022 | US |Thermodynamic computing chips for AI | |Nuvacore | HPC | 2026 | US |General-purpose CPU cores for data centers | |Olix | AI | 2024 | GB |Optical tensor processing unit | |OmniDesign | ANALOG | 2015 | US |Low power analog IP | |One Silicon Chip Photonics | PHOTONICS | 2016 | CA |Optical chips for precision motion sensing | |OniO | RF | 2019 | NO |Wireless micro controller | |OpenLight | PHOTONICS | 2022 | US |Silicon photonics platform and custom PICs | |OpenMachine | AI | 2022 | US |High-performance AI engines for your chip, chiplet, RISC-V SoC, ASIC, and FPGA | |Opsydia | PHOTONICS | 2017 | GB |Laser-written waveguides in glass for optical interconnects | |Optalysys | PHOTONICS | 2013 | GB |Optical computing next-gen cryptography | |optoML | AI | 2024 | SG |Low power AI processors | |ORCA Computing | QUANTUM | 2019 | GB |Photonic quantum computers built from fibre-based modules | |Oso Semiconductor | RF | 2022 | US |Low power RF chip set | |Owl | SENSORS | 2018 | US |Monocular 3D thermal ranging solutions | |Oxford Quantum Circuits | QUANTUM | 2017 | GB |Quantum computing platform | |Oxmiq | AI | 2023 | US |Licensable GPU and AI compute IP | |Ozark ICs | ANALOG | 2011 | US |High temperature ruggedized electronics | |Panmnesia | MEMORY | 2022 | KR |CXL IP | |par.tcl | EDA | 2024 | US |Physics based eda tools | |Paragraf | SENSORS | 2018 | GB |Graphene-based sensors and electronics | |persimmons | AI | 2023 | US |Flexible, low-power generative AI inference system | |Phanofi | PHOTONICS | 2022 | DK |Optical transceivers for data centers & HPC | |Phinity Labs | EDA | 2025 | US |AI agents that design, verify and tape out chips | |Phoenix Semiconductor | ASIC | 2023 | US |Drop in replacements for discontinued devices | |PhovIR | SENSORS | 2023 | GB |Chip-scale MEMS near-infrared sensors for molecular sensing | |Picocom | RF | 2019 | GB |Semiconductor products for 5G infrastructure | |Piris Labs | AI | 2025 | US |Optical inference engine | |Plaid Semiconductor | CHIPLETS | 2023 | US |Interposers for chiplet integration | |planqc | QUANTUM | 2022 | DE |Neutral-atom quantum computers | |Pliops | HPC | 2017 | IL |Scalable data handling/acceleration | |Point2 Technology | NETWORKING | 2014 | US |Low-power interconnect SoCs for data center links | |PointCloud | SENSORS | 2017 | US |4D imaging sensors | |Polaris EO | PHOTONICS | 2021 | US |Ferroelectric based electro-optic modulators | |Polyn Technology | AI | 2019 | IL |Neuromorphic Analog Signal Processor chips | |Powerlattice | ANALOG | 2023 | US |Power delivery chiplets for AI processors | |PQShield | QUANTUM | 2018 | GB |Post-quantum Cryptography Co-processor | |PragmatiC | MFG | 2010 | GB |Manufacturer of low-cost flexible integrated circuits | |Precision Innovations | EDA | 2019 | US |Developing and supporting OpenROAD | |Primemas | CHIPLETS | 2023 | US |Platform for rapid SoC system development | |proteanTecs | ANALOG | 2017 | IL |Analytics platform for advanced chip design | |PseudolithIC | MFG | 2019 | US |Integration process for RF applications | |PsiQuantum | QUANTUM | 2015 | US |Quantum computers | |Q-Pixel | PHOTONICS | 2022 | US |Polychromatic microLEDs and microLED displays | |Qant | PHOTONICS | 2018 | DE |Photonic computing platform | |Qromis | MFG | 2015 | US |Semiconductor materials for WBG | |Qruise | QUANTUM | 2021 | DE |Design and verification of quantum systems | |Quadric.io | AI | 2016 | US |Edge processing for edge devices | |Qualinx | RF | 2015 | NL |IoT GNSS based tracking and connectivity | |QuamCore | QUANTUM | 2022 | IL |Quantum processors for million-qubit scale | |Quandela | QUANTUM | 2017 | FR |Photonic quantum computers and single-photon sources | |Quantum Brilliance | QUANTUM | 2019 | AU |Room-temperature diamond quantum chips | |Quantum Motion | QUANTUM | 2017 | GB |Scalable quantum computer architectural technology | |Quantum Source | QUANTUM | 2021 | IL |Photonic quantum computers using photon-atom gates | |QuantWare | QUANTUM | 2021 | NL |Superconducting quantum processors | |Quera Computing | QUANTUM | 2018 | US |Neutral atom based quantum computers | |Quilter | EDA | 2020 | US |AI driven PCB design | |Quintessent | PHOTONICS | 2019 | US |Optical interconnect | |QuiX Quantum | QUANTUM | 2019 | NL |Photonic quantum processors | |Quobly | QUANTUM | 2022 | FR |Silicon spin-qubit quantum computers | |Raaam | MEMORY | 2021 | IL |High capacity memory technology | |Raana Semiconductors | MFG | 2015 | IN |Czochralski crystal growth systems and single crystals | |RaiderChip | AI | 2024 | ES |AI hardware | |Ramon Space | SPACE | 2004 | IL |Computer system designed for computing in space | |Ranovus | PHOTONICS | 2012 | CA |Photonics interconnect solutions | |Rapid Photonics | MFG | 2022 | NL |Photonic IC production | |RapidSilicon | FPGA | 2021 | US |FPGA devices | |Rebellions | AI | 2020 | KR |AI processors | |RED Semiconductor | HPC | 2021 | GB |Processor technology | |Redwood EDA | EDA | 2015 | US |Transaction level hardware design platform | |Resin Technologies | EDA | 2026 | US |AI-native PCB design tool | |Retym | AI | 2021 | US |Stealth | |Ricursive Intelligence | EDA | 2025 | US |AI models to automate all stages of chip design and verification | |RISE | EDA | 2024 | US |Design and verification productivity platform | |Riverlane | QUANTUM | 2016 | GB |Quantum error correction | |Sagence AI | AI | 2018 | US |Analog in-memory AI inference accelerators | |Salience Labs | PHOTONICS | 2020 | GB |Photonic computing platform | |SambaNova | AI | 2017 | US |AI processing | |Saras Micro Devices | MFG | 2021 | US |Packaging solutions for effective power delivery | |Scalinx | RF | 2015 | FR |Wideband RFIC frontends | |SCI Semiconductor | SECURITY | 2022 | GB |CHERI memory-safe microcontrollers | |Scintil | PHOTONICS | 2018 | FR |Photonic computing platform | |Secqai | QUANTUM | 2021 | GB |Quantum hardware | |SEEQC | QUANTUM | 2019 | US |Digital superconducting chips for quantum computers | |Semidynamics | RISC-V | 2016 | ES |High performance RISC-V IP cores | |Semify | EDA | 2021 | DE |FPGA based platforms | |SemiQA | AI | 2025 | PL |Analog neural network chips for edge AI | |SemiQon | QUANTUM | 2023 | FI |Quantum processors | |Semron | AI | 2020 | DE |AI processing | |SiFive | RISC-V | 2015 | US |RISC-V based IP provider | |Sigmantic AI | EDA | 2025 | US |AI assistant for RTL design | |SigmaSense | SENSORS | 2015 | US |Sensing chips for touch displays and batteries | |SiLC | PHOTONICS | 2018 | US |Photonics based imaging sensors | |Silicon Assurance | EDA | 2020 | US |EDA software that enable secure chip design | |Silicon Box | MFG | 2021 | SG |Semiconductor design and device integration services | |SiliconSpace | EDA | 2025 | US |Cloud based EDA platform | |Silimate | EDA | 2023 | US |Co-pilot for chip designers | |siliXon | EDA | 2025 | GB |PCB designs generated from plain-English prompts | |Silogy | EDA | 2023 | US |Collaborative platform for integrated circuit design | |SiMa.ai | AI | 2018 | US |AI processing for edge devices | |Simbricks | EDA | 2024 | DE |Heterogeneous hardware design and verification platform | |SimplEx Micro | RISC-V | 2021 | US |RISC-V vector processor IP for edge AI | |Singular Photonics | SENSORS | 2024 | GB |High performance camera modules | |SiPearl | HPC | 2019 | FR |Manycore processors | |Siphox | HEALTH | 2020 | US |Biosensing platform for personalized health | |SisuSemi | MFG | 2024 | FI |Atomic-level surface cleaning for chip manufacturing | |Skycore Semiconductors | ANALOG | 2021 | DK |Switched capacitor based integrated power converters | |SMART Photonics | PHOTONICS | 2012 | NL |Indium phosphide photonic integrated circuit foundry | |Snowcap Compute | HPC | 2025 | US |Superconducting computing platform | |Sofant Technologies | RF | 2011 | GB |RF MEMS phased array antennas for satellite communications | |Space Forge | MFG | 2018 | GB |Semiconductor substrate materials grown in space | |Spark Micro | RF | 2016 | CA |Transceivers for low power wireless communication | |Sparxity | AI | 2021 | DE |Dynamic sparsity based inference engine | |Speedata | AI | 2019 | IL |Analytics Processing Unit to accelerate big data | |Sphere Semi | ANALOG | 2024 | US |AI-designed RF and mixed-signal chips and IP | |Spherical | SPACE | 2022 | NL |Satellite power & control with in-house silicon design | |Standard Machines | EDA | 2026 | US |Training environments for AI models that design chips | |StarFive | RISC-V | 2018 | CN |RISC-V processor core IP and devices | |Stathera | MEMS | 2015 | CA |MEMS timing devices | |Swave | PHOTONICS | 2022 | BE |Holographic chips based on diffractive photonics | |SweGaN | MFG | 2014 | SE |GaN-on-SiC epitaxial wafers | |Syenta | MFG | 2022 | AU |Electrochemical process for chip interconnects | |Sygaldry | QUANTUM | 2024 | US |Quantum computers combining multiple qubit types | |SylvarisAI | EDA | 2025 | US |Agentic AI platform for chip verification | |Synapse Semiconductor | SENSORS | 2026 | US |Vision sensor chip that filters data in the pixels | |Synseis | EDA | 2025 | US |AI agents that turn ideas into RTL and FPGA builds | |Synthara | AI | 2020 | CH |In memory computation chips for AI | |Syntiant | AI | 2017 | US |Neuromorphic processing for edge devices | |Tachyum | HPC | 2016 | US |High performance processor architecture | |Tandem PV | MFG | 2016 | US |Silicon solar panels | |Tattvam AI | EDA | 2025 | GB |AI system that automates chip design tasks | |Tensordyne | AI | 2017 | US |AI inference chips and systems | |Tenspresso | AI | 2026 | US |AI inference chips for long-context workloads | |Tenstorrent | AI | 2016 | CA |AI processing devices | |TenX Semi | EDA | 2025 | US |AI agents for chip design and verification | |Teradar | SENSORS | 2020 | US |Solid-state terahertz sensors for vehicles and defense | |TeraSpatial | RF | 2022 | US |Custom RF silicon and AI software for wireless links | |Tetramem | AI | 2018 | US |AI accelerator for edge inference | |Thinktrans Semiconductor | MFG | 2021 | CN |IC packaging substrates | |Thintronics | MFG | 2019 | US |Thin film materials | |Trameto | ANALOG | 2016 | GB |Energy harvesting PMICs | |TriEye | SENSORS | 2017 | IL |Short-wave infrared imaging systems | |TriMagnetix | HPC | 2023 | US |Nanomagnetic processors combining logic and memory | |Tsavorite Scalable Intelligence | AI | 2023 | US |Composable AI processors | |TUSK IC | RF | 2018 | BE |Ka-band mmWave CMOS beamformer chips for satellite antennas | |TYLsemi | CHIPLETS | 2026 | US |Chiplets for AI infrastructure | |Ubilite | RF | 2014 | US |Low power wireless communication for IoT | |Ubitium | AI | 2024 | DE |Universal processor | |Uhnder | SENSORS | 2015 | US |Digital automotive radar SoC | |Unconventional AI | AI | 2025 | US |Analog AI chips | |Unifabrix | NETWORKING | 2020 | IL |CXL based secure connectivity solution | |Upscale AI | NETWORKING | 2024 | US |Switch silicon for AI scale-up networks | |Usound | MEMS | 2012 | AT |Sound solutions based on MEMS technology | |Vaire Computing | ANALOG | 2021 | GB |Near zero energy computing | |Vayyar | SENSORS | 2011 | IL |High resolution image sensors | |Vector Photonics | PHOTONICS | 2020 | GB |Semiconductor lasers | |VerifAI | EDA | 2020 | US |AI assisted hardware design and verification | |Verifaix | EDA | 2024 | US |AI assisted hardware design and verification | |Vertical Semiconductor | ANALOG | 2024 | US |Vertical GaN power transistors | |Vervesemi | ANALOG | 2017 | IN |Analog signal chain ICs with machine learning calibration | |Vinci | EDA | 2023 | US |Physics-based AI for hardware design and simulation | |Viqthor | QUANTUM | 2023 | FR |Quantum processing | |Visibl Semiconductors | EDA | 2024 | US |AI assisted hardware design and verification | |VisIC Technologies | ANALOG | 2010 | IL |GaN power transistors and modules for EVs | |Volantis Semiconductor | AI | 2022 | US |AI processors | |VoltAI | EDA | 2022 | US |AI models for semiconductor | |Vsora | AI | 2015 | FR |AI inference chips | |Wave Photonics | PHOTONICS | 2021 | GB |Photonics design platform | |Waveforge | EDA | 2026 | GB |AI-driven design automation for analog and RF chips | |weeteq | AI | 2022 | GB |AI for real-time control inside microcontrollers | |Welinq | QUANTUM | 2022 | FR |Quantum interconnects | |Xcelerium | HPC | 2020 | US |Domain specific processors for converged workloads | |XCENA | MEMORY | 2022 | KR |CXL memory solutions | |Xconntech | HPC | 2020 | US |CXL and PCIe switch chips | |ximplic | EDA | 2025 | NL |device-agnostic EDA ecosystem tailored for Computing-in-Memory (CIM) design | |xLight | MFG | 2021 | US |Free-electron laser EUV light sources | |Xscape Photonics | PHOTONICS | 2022 | US |Photonic communication chips | |Xsight Labs | HPC | 2017 | IL |Chip sets for accelerating data-intensive workloads | |Yorchip | CHIPLETS | 2023 | US |Chiplet technology | |Zendar | SENSORS | 2017 | US |High resolution software defined radar | |Zepsor | SENSORS | 2021 | US |Zero-power MEMS infrared sensors | |Zero Point Motion | MEMS | 2020 | GB |Photonics/MEMS motion sensors | |ZeroASIC | CHIPLETS | 2008 | US |Chiplet based ASIC platform | |ZeroPoint | MEMORY | 2015 | US |Memory compression technology | |zeroRISC | SECURITY | 2023 | US |Open source Root-of-Trust platform | |Zettascale Computing | AI | 2024 | US |Reconfigurable chips for AI | |Zoo | EDA | 2021 | US |AI driven CAD | |ZuriQ | QUANTUM | 2024 | CH |Trapped-ion quantum computers using 2D Penning micro-traps |

Alumni

| Company | Technology | Country | Exit | Year | Value($M) | Link | |---------|------------|---------| ------- | ------ | ------|------| |Acacia | PHOTONICS | US | IPO | 2016 | 1000 | Source | |Adesto Technologies | MEMORY | US | IPO | 2015 | 87 | Source | |Advanced Circuit Pursuit | RF | CH | Sequans | 2025 | NA | Source | |Aeluma | SENSORS | US | SPAC | 2021 | NA | Source | |Agnilux | HPC | US | Google | 2010 | NA | Source | |Akeana | RISC-V | US | Qualcomm | 2026 | NA | Source | |Alif Semiconductor | AI | US | Analog Devices | 2026 | 1350 | Source | |Alpha & Omega Semiconductor | ANALOG | US | IPO | 2010 | 391 | Source | |Alphawave | NETWORKING | CA | IPO | 2021 | 4300 | Source | |Altair Semiconductor | SENSORS | IL | Sony | 2016 | 212 | Source | |Ambarella | AI | US | IPO | 2012 | 157 | Source | |Ambiq | ASIC | US | IPO | 2025 | 656 | Source | |Ambric | HPC | US | Shutdown | 2008 | 0 | Source | |Ampere Computing | HPC | US | Softbank | 2025 | 6500 | Source | |Annapurna Labs | HPC | IL | Amazon | 2015 | 350 | Source | |Anobit | MEMORY | IL | Apple | 2012 | 500 | Source | |Applied Optoelectronics | PHOTONICS | US | IPO | 2013 | 126 | Source | |Aquantia | NETWORKING | US | Marvell | 2019 | 452 | Source | |Arbe | SENSORS | IL | SPAC | 2021 | 525 | Source | |Arteris | EDA | US | IPO | 2021 | 546 | Source | |Astera | HPC | US | IPO | 2024 | 9500 | Source | |Athos Silicon | CHIPLETS | US | Shutdown | 2026 | 0 | Source | |Atlantic Quantum | QUANTUM | US | Google | 2025 | NA | Source | |Atomera | MFG | US | IPO | 2016 | 91 | Source | |Audience | ANALOG | US | IPO | 2012 | 371 | Source | |Axis Semiconductor | HPC | US | Shutdown | 2022 | 0 | Private Communication | |Banias | PHOTONICS | IL | Alphawave | 2022 | 240 | Source | |BCD Semiconductor | ANALOG | CN | IPO | 2011 | 186 | Source | |Blaize | AI | US | SPAC | 2025 | 1330 | Source | |Blue Cheetah Analog | CHIPLETS | US | Tenstorrent | 2025 | NA | Source | |BrainChip | AI | AU | SPAC | 2015 | NA | Source | |Calxeda | HPC | US | Shutdown | 2013 | 0 | Source | |Cambricon | AI | CN | IPO | 2020 | 12100 | Source | |Celestial AI | PHOTONICS | US | Marvell | 2025 | 3250 | Source | |Cerebras | HPC | US | IPO | 2026 | 64000 | Source | |Chipstack | EDA | US | Cadence | 2025 | NA | Source | |Classiq | EDA | IL | Intel | 2026 | 1900 | Source | |Clearspeed | HPC | GB | IPO | 2007 | 20 | Source | |Condor Computing | RISC-V | US | Shutdown | 2026 | 0 | Source | |Credo | NETWORKING | US | IPO | 2022 | 1630 | Source | |Cycuity | EDA | US | Arteris | 2025 | NA | Source | |Dfiant | EDA | US | Shutdown | 2026 | 0 | Source | |Diakopto | EDA | US | Ansys | 2023 | NA | Source | |DreamBig | CHIPLETS | US | ARM | 2025 | 265 | Source | |Dust Photonics | PHOTONICS | IL | Credo | 2026 | 1300 | Source

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